| Model number |
Sintering conditions |
Sheet resistance |
Weldability |
Vertical Pull-Out Force |
| SF-3100 |
200-250℃ / 30min |
<10mΩ/□/25.4μm |
260℃/2s, tinning ≥90% |
>50N (3×3mm) |
| SF-3200 |
450℃ / 30min |
<4mΩ/□/25.4μm |
300℃/2s, tinning ≥90% |
>100N (3×3mm) |
SF-3100 (sintering at 200–250°C): Suitable for conventional ceramic substrates.
SF-3200 (sintered at 450°C): Suitable for ceramic components with higher temperature requirements.
Solderability: Can be tinned in 2 seconds at 260–300°C, with a tinning coverage of ≥90%. It exhibits excellent wettability with solder, making it well-suited for subsequent component placement.
III. LTCC Technology: A Core Technology for 5G Base Stations
LTCC (Low Temperature Co-fired Ceramic) involves forming thin “green ceramic tapes” from ceramic powder, then using laser drilling, slurry filling, and silver‑paste patterning to create circuit traces on these tapes. Multiple layers are subsequently stacked and sintered at temperatures above 300°C, resulting in a three‑dimensional, high‑density circuit.
Why is it important?
● 5G base stations must process large volumes of high-frequency signals, and conventional circuit boards are prone to generating interference.
● LTCC can embed multiple components within the ceramic substrate, forming a compact module.
● Particularly well suited for high-frequency communication components, such as base station antennas and filters.
Bettley’s silver pastes (including SF-3100 and SF-3200) It is the key conductive material used in this LTCC process.
IV. Reliability Testing: Built to Withstand Rigorous Use
Base station equipment is exposed to the elements year-round, with extreme temperature fluctuations; therefore, the silver paste must be exceptionally robust. Betely products have successfully passed a comprehensive series of reliability tests:
| Test Item |
Test conditions |
Result |
| Welding temperature |
360° |
PASS |
| Tin-plating rate |
— |
95% (standard > 90%) |
| Induction welding |
380℃/10S |
6 times (standard: 3–5 times) |
| Welding voids |
— |
6% (standard <10%) |
| Cold and heat shock |
-40℃ to 125℃, 14 days |
PASS |
| Salt Spray Test |
5% saline solution, 35°C, 3 days |
PASS |
| High temperature and high humidity |
65℃/95%RH, 3 days |
PASS |
| Solder joint push-pull |
>50N |
No divestiture, PASS |
Several noteworthy highlights:
● Tinning rate: 95%: More than 90% of the standards are met, and weld quality is stable.
● Induction welding, 6 times: The standard requires only 3–5 cycles, but Betely achieved 6, demonstrating reliability even under repeated welding conditions.
● Welding porosity: 6%: Below the 10% threshold, fewer voids indicate stronger welds and more stable electrical conductivity.
● 14-day thermal shock test: After being subjected to cycling between −40°C and 125°C for two weeks, the silver paste shows no delamination or cracking.
These tests demonstrate that, Bettley’s silver paste is not only suitable for laboratory use but also withstands the harsh conditions of the real world.
Summary
| Application scenarios |
Recommended model |
Core Advantages |
| Mobile phone antenna (plastic substrate) |
SF-8100 / SF-8300 |
Low-temperature curing (70–150°C), adhesion rating 5B, sheet resistance ≤10 mΩ. |
| Base Station LTCC Ceramic Assembly |
SF-3100 / SF-3200 |
High-temperature sintering (200–450°C), sheet resistance < 4–10 mΩ, pull-off force > 50–100 N. |
| Scenarios with high reliability requirements |
Full series |
It passes all tests—thermal shock, salt spray, and high-temperature, high-humidity conditions—with a solderability rate of 95%. |
Next time you use your 5G phone, take a moment to notice: the very component that keeps your signal at full strength might be tucked away inside the phone’s back cover—or stationed in a base station just a few kilometers away—working quietly as a slender “silver wire.”
Betely is dedicated to the R&D, production, and sales of core materials in the electronic chemicals sector, enabling conductivity that extends far beyond printed circuit boards.
