Heterojunction main and auxiliary grid silver (copper) paste

A curable polymer-based conductive silver (copper) paste suitable for metallization printing of both main and secondary busbars on the front and back sides of N-type silicon heterojunction solar cells.

Product Features and Advantages

High electrical conductivity, low contact resistance

Excellent continuous printing performance, suitable for narrow‑opening printing.

Silver or silver-clad copper options are available.

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

TDS Download

SDS Download

SF-3000A

Silver paste specially formulated for the front and back main grids of HJT cells, with a silver content of 92–94% and a resistivity ≤ 6.0 × 10⁻⁶ Ω·cm. It offers excellent solderability and adhesion, and is suitable for curing at 190–220°C.

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SF-3000B

A dedicated pure silver paste for the front and back side busbars of HJT cells, with a silver content of 93–94% and a resistivity of 5.0–5.5 × 10⁻⁶ Ω·cm. It delivers consistent performance on both sides and is suitable for high-speed printing.

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SF-3000C

Silver–copper pastes for HJT back-contact and Topcon seed‑layer screen printing, with silver content ranging from 10% to 55%; multiple grades available for customization. Resistivity: 5.0–12.0 × 10⁻⁶ Ω·cm, depending on silver content. Select the appropriate grade flexibly based on cost and conductivity requirements.

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