Silver paste for power protection devices and silver paste for firing‑in holes in fired ceramics

Screen-printed electrodes and through-hole and via-filling pastes, suitable for through-hole conductive interconnections or via filling in ceramic circuit boards used in power protectors and other passive components; they exhibit low sintering shrinkage and a dense silver layer.

Product Features and Advantages

Excellent electrical conductivity

Good hole-filling performance.

Strong adhesion to ceramic substrates

High-temperature sintering resistance

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

TDS Download

SDS Download

SF-2995-3

Through-hole conductive silver paste, with a solid content of 87±2%, offers excellent conductivity, high adhesion strength, and stable through-hole conductivity, making it suitable for through-hole connections in power‑protection devices.

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SF-3580

Silver paste for filling holes, with a solid content of 94.3 ± 2%, sintered at 850–920°C; exhibits low shrinkage and no cracks along the hole edges, making it suitable for filling holes in fired ceramic components used in power‑protection devices.

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SF-3700-3

Filling paste silver slurry, with a solid content of 94.3 ± 2%, exhibits the highest viscosity (suitable for large-diameter through-holes), sintered at 850–920°C, and is ideal for filling ceramic components in power‑protection devices.

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