Copper paste sintered in a nitrogen atmosphere

A conductive copper paste sintered in a nitrogen atmosphere. The paste requires nitrogen as a protective gas during high-temperature sintering.

Product Features and Advantages

Nitrogen-atmosphere sintering

Good antioxidant properties

Good electrical conductivity

Excellent adhesion

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

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SDS Download

SF-3601

Copper paste sintered in a nitrogen atmosphere, with a solid content of 85 ± 2%, sheet resistance ≤ 3 mΩ/□, and sintered under nitrogen protection at 700–850°C (oxygen partial pressure < 100 ppm). Suitable as a silver‑paste replacement for applications such as LEDs, ceramic circuit boards, 5G electromagnetic shielding, and filters.

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