Perovskite tandem solar cell silver (copper) paste

A low-temperature-curable polymer-based conductive silver (copper) paste suitable for back‑grid metallization in perovskite tandem solar cells.

Product Features and Advantages

Excellent conductivity

Low contact resistance

Printable fine lines

Silver or silver-clad copper options are available.

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

TDS Download

SDS Download

SF-3000X-PSC

Perovskite tandem solar cell back‑grid low‑temperature silver (copper) paste, cured at 100–120°C; the pure silver formulation contains 94% silver, while the silver‑copper formulation contains 40% silver. Curing conditions: 100–120°C for 30 minutes.

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