Conductive silver paste for epoxy systems

A single-component, high-performance, cured conductive paste, meticulously formulated from highly conductive silver powder, an epoxy resin system, and solvents, suitable for screen-printing or dispensing processes.

Product Features and Advantages

High bonding strength

Good heat resistance (can withstand temperatures above 150°C)

Stable conductivity

Suitable for dispensing and printing processes.

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

TDS Download

SDS Download

SF-8500

Epoxy‑based dispensing/adhesive silver paste, with a solids content of 82±2%, sheet resistance of 40±10 mΩ/□, hardness of 4H, adhesion rating of 5B, cured at 150°C for 30 minutes, and tensile strength exceeding 50 N. Suitable for conductive bonding of electronic components.

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