Silver paste for RF electrodes and GPS antennas

A high-temperature sinterable conductive silver paste, upon sintering at elevated temperatures, exhibits excellent adhesion to ceramic substrates such as alumina, zirconia, and perovskite‑type materials, meeting performance requirements for thermal conductivity, electrical conductivity, signal transmission, high‑temperature soldering, and chemical plating with acid–alkali resistance.

Product Features and Advantages

Excellent high-frequency performance

Low dielectric loss

Good adhesion to ceramic substrates.

High temperature resistance, high reliability

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

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SF-2995

MONOBLOCK printing silver paste, with sheet resistance ≤ 2 mΩ/□, extremely high viscosity, sintered at 850–870°C, and suitable for ceramic substrates such as alumina and zirconia.

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SF-2980A

High-temperature electrode silver paste, with a solids content of 72±2%, sheet resistance ≤3 mΩ/□, and soldering strength ≥80 N; exhibits excellent weldability and solder resistance, suitable for ceramic circuit boards and RFID applications.

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SF-2980B

High-temperature sintering silver paste, with a solids content of 64.5 ± 2%, sheet resistance ≤ 2 mΩ/□, and a viscosity of 250,000–350,000 mPa·s (relatively high). Sintered at 850°C for 10–15 minutes, suitable for ceramic circuit boards, RFID radio-frequency tags, antennas, and more.

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SF-2980C

High-temperature sintering silver paste, with a solids content of 54.5 ± 2%, sheet resistance ≤ 3 mΩ/□, sintered at 850°C for 10–15 minutes; suitable for ceramic circuit boards, RFID radio-frequency tags, antennas, and more.

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SF-2996

High-temperature sinterable silver paste, with a solids content of 78.5 ± 2%, sheet resistance ≤ 3 mΩ/□, soldering strength ≥ 150 N, and solderability ≥ 95% (at 260°C using solder paste). Sintered at 810–870°C for 15 minutes; specifically designed for surface metallization of ceramic dielectric filters and MONOBLOCK components.

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