High-refractive-index encapsulant

High-refractive-index silicone encapsulant, two-component heat-curing formulation, designed for LED chip packaging. It features high light transmittance, high refractive index, excellent weather resistance, superior flowability, outstanding thermal stability, and no by-products upon curing.

Product Features and Advantages

Refractive index ≥ 1.53

High light transmittance

High reliability

Dispensing process

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

TDS Download

SDS Download

BQ-4238AB

Suitable for LED and other photodiode packages, and can be used in conjunction with phosphors; compatible with small‑size leads such as 4014, 3006, 2835, and 3030 made from PPA or PCT materials, with a power rating of ≤1 W.

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BQ-4242AB

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BQ-8101AB

Applied to high-power/automotive-grade LED surface-mount packages;

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BQ-8232AB

Suitable for LED and other photodiode packages, and can be used in conjunction with phosphors; compatible with small‑size leadframes such as 4014, 3006, 2835, and 3030 made of PPA or PCT materials, with a power rating not exceeding 1 W.

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BQ-8269AB

This bracket is suitable for LED and other photodiode packages and can be used with phosphor; it is compatible with small‑size brackets such as 4014, 3006, 2835, and 3030 made of PPA or PCT materials, with a power rating not exceeding 0.2 W.

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BQ-8278-16AB

This adhesive is suitable for encapsulating LEDs and other optoelectronic diodes and can be used in conjunction with phosphors. It is compatible with small‑size leads such as 4014, 3006, 2835, and 3030 made from PPA or PCT materials, provided the power rating does not exceed 1 W.

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BQ-8351AB

This product is a high‑flow, low‑viscosity adhesive, suitable for applications with high powder‑to‑binder ratios and wide color gamuts.

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