LTCC via-filling silver paste

Screen-printed via-fill paste, suitable for through-hole filling in LTCC chip capacitors, inductors, and other passive components.

Product Features and Advantages

Good hole-filling performance, no bubbles.

Compatible with LTCC green tapes

Low shrinkage and excellent co-firing compatibility.

Excellent electrical conductivity

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

TDS Download

SDS Download

SF-3580A

LTCC via‑fill silver paste, with a solid content of 70 ± 2%, sintered at 850–920 °C; exhibits low shrinkage and no cracks at the via walls, making it suitable for via‑fill applications in LTCC chip capacitors and inductors.

文件下载

SF-3700

LTCC via‑fill silver paste, with a solids content of 94 ± 2% (high solids), sintered at 850–920°C, exhibiting low shrinkage and a dense silver layer; suitable for via‑filling in ferrite inductors and LTCC chip capacitors.

文件下载