Low-temperature sintered silver paste for aluminum substrates

Low-temperature sintered silver paste for aluminum substrates

A high-performance sintered conductive paste, meticulously formulated from highly conductive silver powder, a binder, and a solvent, exhibits excellent electrical conductivity and solderability.

Product Features and Advantages

Low-temperature sintering

Excellent adhesion to aluminum alloys

High thermal conductivity, low electrical resistance

Suitable for screen printing and dispensing.

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Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

TDS Download

SDS Download

SF-3200

Low-temperature sintered silver paste, sintered at 450–550°C, with sheet resistance ≤ 3 mΩ/□ and adhesion ≥ 50 N, suitable for silver plating on aluminum alloy components and for wire bonding on temperature‑limited substrates.