Flexible conductive silver-copper paste

A conductive silver–copper paste that combines low electrical resistance with flexibility, formulated through meticulous grinding of high-performance resins and highly conductive silver and silver–copper powders.

Product Features and Advantages

Good electrical conductivity

Excellent flexibility and bend resistance.

The cost is significantly lower than that of pure silver paste.

Good printability

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

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SDS Download

SF-1300

Low-temperature, fast-drying silver–copper paste with a sheet resistance of less than 15 mΩ/□, bendability of at least 5 cycles, and a solid content of 50% or higher; suitable for printing thin-film switches and blood-glucose test strips on PET, PI, and TPU substrates.

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SF-2700 Series

A conductive silver–copper paste with high solid content (Type A ≥ 85%, Type C ≥ 70%) and ultra-low sheet resistance (Type A: 6–10 mΩ/□), exhibiting adhesion of 5B and hardness of ≥3H; specifically, Type A achieves a hardness of ≥4H and supports a solder‑pull force of ≥10 N, while Type C offers bendability of ≥3 cycles. It is suitable for membrane switches and blood glucose test strips.

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