3C Electronics

3C Electronics

Betely 3C electronic materials solutions span functional areas including structural components, surface treatment, and adhesive bonding, offering a one-stop product portfolio that ranges from silicone rubber substrates to surface coatings and conductive materials.

Structural Component Materials

Structural Component Materials

Structural components serve as the backbone and outer shell of consumer electronics, directly influencing product strength, tactile feel, and service life. Betely offers a comprehensive range of structural materials, spanning from standard silicone rubber to high‑density, highly durable solid silicone rubbers, meeting the diverse requirements of smartwatch straps, phone cases, card holders, buttons, and other parts in terms of hardness, density, and wear resistance.

Surface Treatment and Coating Materials

Surface Treatment and Coating Materials

Surface treatment and coating are key to enhancing a product’s aesthetic appeal and user experience. Betley offers a comprehensive range of surface‑finishing solutions, including matte oils, UV coatings, and silicone coatings, delivering a variety of tactile and visual effects—such as a skin‑friendly, smooth feel, excellent wear and scratch resistance, and superior fingerprint resistance.

Adhesive and Laminating Materials

Adhesive and Laminating Materials

Bonding and lamination are critical processes for achieving multi-material composite assembly. Betley offers a comprehensive range of adhesive solutions, including UV pressure-sensitive adhesives, plastic adhesives, UV transfer adhesives, and UV bonding agents, meeting the diverse requirements of screen lamination, structural bonding, and texture transfer in terms of bond strength, light transmittance, and curing speed.

Conductive and Antenna Materials

Conductive and Antenna Materials

Conductive and antenna materials are essential to enabling touch, communication, and RF functions in consumer electronics. Betley offers a comprehensive suite of conductive solutions, including touch‑screen conductive silver pastes, NFC antenna silver pastes, PDS‑process silver pastes, conductive inks, and EMI shielding inks, meeting diverse needs—from touchscreens to antennas, and from flexible circuits to electromagnetic shielding.

Electronic Protection and Packaging Materials

Electronic Protection and Packaging Materials

Electronic protective and encapsulating materials are critical functional materials that ensure the long-term reliable operation of 3C electronic products, encompassing four major application areas: circuit board protection, whole‑device waterproof sealing, chip packaging, and LED encapsulation. Our products address core requirements—such as thermal management, electrical insulation, moisture resistance, sulfurization resistance, and optical performance—in response to trends toward higher integration and greater power density, offering end-to-end material solutions spanning from the chip level to the complete device level.