Electronic Protection and Packaging Materials

Electronic Protection and Packaging Materials

Electronic protection and packaging materials are critical functional materials that ensure the long-term, reliable operation of 3C electronic products. They cover four key application areas: circuit board protection, waterproofing and sealing for complete devices, chip packaging, and LED packaging. Addressing core requirements—such as heat dissipation, insulation, moisture resistance, sulfur resistance, and optical performance—driven by trends toward high integration and high power density, our company provides comprehensive material solutions spanning from the chip level to the complete device level.

  • Insulating ink
    Insulating ink
    Membrane switch
    Excellent insulation properties
  • Waterproof sealant
    Waterproof sealant
    Circuit Protection for Electronic Components
    Moisture- and water-resistant; withstands exposure to sweat and rain.
  • Hydrophobic agent
    Hydrophobic agent
    Circuit Protection for Electronic Components
    Moisture-proof and waterproof
  • UV insulating ink
    UV insulating ink
    Circuit board protective layer
    Rapid curing; high insulation resistance; chemical resistance.

Related products

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    High-refractive-index encapsulation adhesive
  • Medium-Refractive-Index Encapsulation Adhesive (Mini LED)
    Medium-Refractive-Index Encapsulation Adhesive (Mini LED)
  • Low-refractive-index encapsulation adhesive (COB LED strip adhesive)
    Low-refractive-index encapsulation adhesive (COB LED strip adhesive)