Thin-film primer

Thin-film primer

This product employs a specialized resin‑curing technology and serves as an adhesion‑promoting primer suitable for unprimed PET films, PI films, and coated film substrates. Its key advantages include strong adhesion to both the film substrate and coating layers, excellent resistance to high‑temperature and high‑humidity conditions, and moderate resistance to 10% alkaline solutions. It is widely used in applications such as packaging for mobile phone batteries, laptop batteries, various electronic tapes, and as a primer for electronic film materials.

Product Features and Advantages

Improve adhesion

Good water resistance

Easy to apply

Compatible with multiple films

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Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

TDS Download

SDS Download

CSKM-S20417

Mixing ratio: CSKM-S20417 (main component) : CSNB-R23350 (curing agent) : methyl ethyl ketone = 100:5:100 (by mass).

CSKM-S20430

Mixing ratio: CSKM-S20430 (main component) : CSNB-R23350 (curing agent) : methyl ethyl ketone = 100:5:100 (by mass).

CSKN-K00110

Mixing ratio: CSKN-K00110 (main component) : CSNB-R23350 (curing agent) : methyl ethyl ketone = 100 : 3 : 60 (by mass).