Low-temperature curing silver paste

A high-performance, thermosetting conductive paste, formulated with highly conductive silver powder, resin, additives, and solvents, exhibits excellent electrical conductivity.

Product Features and Advantages

Low-temperature curing (80–120°C)

Excellent adhesion to PET and PI films.

Stable conductivity

Excellent flexibility, suitable for pad printing on curved surfaces.

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

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SDS Download

SF-8200

Universal silver paste for screen printing and pad printing, with sheet resistance ≤ 10 mΩ/□ and adhesion ≥ 4B, suitable for 5G antennas, display‑panel conductive traces, and conductive circuits on multiple substrates including PET, PC, PI, glass, and ceramics.

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SF-9000

Conductive silver adhesive specially formulated for dispensing, with an ultra‑high solids content of 93±1%, sheet resistance ≤12 mΩ/□, and adhesion rating 5B. Suitable for precision dispensing applications such as potting and filling.

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SF-8900

Pad-printable, highly wear-resistant silver paste; silver–nickel composite system; RCA abrasion resistance ≥ 2,500 cycles; sheet resistance ≤ 50 mΩ/□; adhesion rating 5B; suitable for conductive applications requiring high hardness, such as feed‑point wear resistance.

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SF-3200A

Silver–nickel composite ink for pad printing, with sheet resistance ≤25 mΩ/□, hardness ≥4H, RCA abrasion resistance ≥2,000 cycles, and adhesion rating 5B; suitable for wear‑resistant conductive applications on substrates such as metal, glass, and ceramics.

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SF-8400

High-conductivity silver paste specially formulated for pad printing, with a solids content of 83±2%, sheet resistance ≤12 mΩ/□, and a volume resistivity of approximately 2.0×10⁻⁵ Ω·cm. It cures at a minimum of 80°C, exhibits adhesion rating of 5B, and is suitable for 5G terminal antennas and thermosensitive substrates.

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SF-3200C

High-conductivity silver paste for pad printing, with sheet resistance ≤ 10 mΩ/□, volume resistivity ≤ 3.5 × 10⁻⁵ Ω·cm, hardness ≥ 3H, adhesion rating 5B, and rapid low-temperature curing at 90°C; suitable for substrates such as metal, glass, and ceramics.

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