High-Temperature Sintering Silver Paste for Ceramic/Glass Substrates

A high-temperature sintering conductive silver paste meticulously formulated from high-performance silver powder, glass powder, and an organic binder.

Product Features and Advantages

High-temperature sintering

Strong adhesion to ceramic and glass substrates

High thermal conductivity, low electrical resistance

Suitable for screen printing and dispensing.

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

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SF-2985

High-temperature sintering conductive silver paste, with a solids content of 88±2%, sheet resistance ≤3 mΩ/□, solder joint strength ≥150 N, and solderability ≥95% (at 300°C for 3 seconds). Sintered at 850–870°C for 10 minutes, it is suitable for applications in LEDs, ceramic circuit boards, 5G electromagnetic shielding, RFID RF antennas, and other fields.

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SF-2985A

High-temperature sintering conductive silver paste, with a solids content of 88±2%, sheet resistance ≤3 mΩ/□, and solder joint strength ≥150 N. It exhibits excellent solderability, sintering at 850–870°C for 10 minutes, and outstanding adhesion to alumina/zirconia ceramics and metal alloy substrates, delivering superior solderability.

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SF-2985E

High-temperature sintering conductive silver paste, with a solids content of 88±2%, sheet resistance ≤2 mΩ/□ (minimum among the three), solder joint strength ≥150 N, and solderability ≥95% (300°C × 3 s). Sintered at 850–870°C for 10 minutes, it exhibits superior electrical conductivity, solderability, and surface brightness.

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SF-2991

A high‑temperature sintering pad silver paste meticulously formulated from high‑performance silver powder, glass powder, and an organic binder. It exhibits excellent electrical conductivity and solderability, along with superior oxidation resistance. It meets performance requirements for thermal management, electrical conduction, signal transmission, high‑temperature soldering, and chemical plating with acid–alkali resistance.

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