Photovoltaic seed-layer silver paste

It is used in the overlay/plating process for TOPCon and BC cells, featuring a “seed layer + silver‑copper/copper grid line” configuration, serving as the underlying conductive contact layer to deliver low contact resistance, high adhesion, and effective copper diffusion barrier.

Product Features and Advantages

Good adhesion to silicon wafers

Excellent electrical conductivity

Suitable for electroplating processes

Chemical resistance

Product Series

(Customized formulations can be provided based on customer requirements.)

Grade

File Description

TDS Download

SDS Download

SF-3201

Photovoltaic seed-layer silver paste, with a solid content of 83 ± 2%, a resistivity ≤ 3.0 μΩ·cm, and a contact resistance ≤ 2.0 mΩ·cm², is used as the underlying conductive contact layer in TOPCon and BC cell seed layers, as well as in overprint or electroplating processes for silver‑copper or copper grid lines.

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