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Electronic Protection and Packaging Materials

Electronic protection and packaging materials are critical functional materials that ensure the long-term, reliable operation of 3C electronic products. They cover four key application areas: circuit board protection, waterproofing and sealing for complete devices, chip packaging, and LED packaging. Addressing core requirements—such as heat dissipation, insulation, moisture resistance, sulfur resistance, and optical performance—driven by trends toward high integration and high power density, our company provides comprehensive material solutions spanning from the chip level to the complete device level.

Circuit Board Protection

Whole-Unit Waterproof Sealing

LED Packaging

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$High-refractive-index LED encapsulation adhesive$

High-refractive-index LED encapsulation adhesive

Mobile phone camera flash; laptop display backlight LEDs.

Refractive index ≥ 1.53, high light transmittance, high reliability, dispensing process

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