Pad printing, dispensing, laser marking, dip coating… How do you choose the right conductive paste for each process?

2026-07-31 10:08

Even though they are all conductive pastes, why are some suitable for screen printing, others require high‑temperature sintering, and still others can cure at just 80°C?

The answer is simple: process dictates formulation, and application context determines equipment selection.

Today, we’ll help you clarify your thinking—choose your slurry based on the “process,” and tailor your solution to the specific “application scenario.”

🔹 Scenario 1: Narrow bezel touchscreen + laser-cutting process

Laser‑engraved silver paste is specially designed for narrow‑bezel processes in capacitive and resistive touchscreens, enabling ultra‑fine traces (with the SF‑2880 achieving a minimum L/S of 20 μm/20 μm) and clean, well‑defined edges through precise laser cutting.

Three options are available: the SF-2772 series offers enhanced conductivity, while the SF-2750 series is a versatile, cost‑effective solution that supports substrates such as ITO glass, ITO‑coated glass, and nano‑silver films; its environmental reliability has been validated.

🔹 Scenario 2: Pad printing + curved or irregular-shaped substrates

Pad-printing silver paste is specially designed for applications where screen printing cannot adequately cover curved or irregular surfaces, offering both conductivity and flexibility.

High conductivity requirements: SF-8400 (sheet resistance ≤ 12 mΩ/□), SF-3200C (sheet resistance ≤ 10 mΩ/□, low‑temperature curing at 90°C)
High wear resistance requirements: SF-3200A (RCA ≥ 2,000 cycles), SF-8900 (RCA ≥ 2,500 cycles)

🔹 Scenario 3: Dispensing Process

Dispensing requires the paste to exhibit excellent application‑and‑set properties, ensuring that the dispensed bead does not flow or spread.

SF-9000: Ultra-high solids content (93±1%), with excellent dispensing and shaping performance.
SF-8500: An epoxy system with high bond strength (tensile strength > 50 N) and excellent heat resistance (≥150°C).

🔹 Scenario Four: Hole-Drilling Process

Via filling involves depositing a conductive paste into through-holes to achieve interlayer interconnection, requiring the paste to exhibit excellent fillability and wettability, fully occupy the vias without voids or air bubbles, and yield a dense, crack-free silver layer upon sintering.

SF-3580A: Solid content 70±2%, low shrinkage, and no cracks at the hole edges.
SF-3700: Solid content 94±2%, suitable for large-diameter through-holes or applications requiring higher silver-layer density.

🔹 Scenario 5: Dip-Coating Process (for ceramic filters, etc.)

Dip coating requires the slurry to have appropriate viscosity and flowability, enabling the formation of a uniform silver layer on the surface of ceramic components.

SF-3400: Solid content 80±2%, suitable for surface metallization of ceramic filters.
SF-3400B: Solid content 85±2%, electrical conductivity ≥45×10⁶

🔹 Scenario Six: High-Temperature Sintering + Ceramic/Glass Substrates

After high-temperature sintering at approximately 850°C, the silver paste forms a robust bond with the substrate, meeting requirements for thermal conductivity, electrical conductivity, signal transmission, and high-temperature soldering.

SF-2985 Series: Solid content 88±2%, sheet resistance ≤2–3 mΩ/□, soldering strength ≥150 N.
SF-2991: For glass substrates only, sintering temperature 650–680°C.

🔹 Scenario 7: Low-Temperature Curing + Heat-Sensitive Substrates (PET/PI/PC)

Low-temperature silver paste cures at 80–120°C, without damaging flexible film substrates, while exhibiting excellent conductivity and adhesion.

SF-8200: Suitable for both screen printing and pad printing, with adhesion of ≥4B.
SF-8600: Sheet resistance ≤ 10 mΩ/□, dual-cure system, excellent reliability.
SF-3210: Solderable silver paste, low‑temperature curing at ≥80°C, suitable for conductive and solderable applications on heat‑sensitive substrates.

Betely conductive paste product portfolio covers the mainstream methods of conductive trace fabrication described in this paper and has established a well‑established library of product models tailored to various processes.

However, even after the process has been optimized, whether the conductive paste can truly be implemented depends on its ability to meet the specific requirements of each industry application. To this end, Betely conductive pastes have been extensively deployed across multiple sectors—including photovoltaic cell metallization, 3C electronics, new‑energy vehicles, and medical sensing—and have successfully passed large‑scale validation under a variety of substrate materials and curing conditions.

Process determines the base formulation of the slurry, while application scenario dictates the final selection. There is no one-size-fits-all slurry—only the slurry that best suits your process and production line. Share your substrate, process requirements, and performance expectations with us, and leave the rest to us to match.

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