From lighting to displays, Betely is deeply committed to Mini-LED encapsulation adhesives.

2026-06-10 10:20

In the first installment, we introduced what LED encapsulant is and Betely market position in this field. In this issue, we’ll explore Betely technological evolution in encapsulants—moving from general lighting to Mini-LED displays.

I. Over a Decade of Iterations: From BQ-4138 to BQ-8232

Betely LED encapsulant products have undergone more than a decade of iterative development:

Stage	Representative products	Core Breakthrough
First generation	BQ-4138	Achieve foundational performance and break the import monopoly.
Second generation	BQ-4157, BQ-4158	Performance optimization and enhanced stability
Third generation	BQ-4238(S), BQ-4239	Enhance adhesion and reliability
Fourth generation	BQ-4242	Ultra-high sulfur resistance
Fifth generation	BQ-4232, BQ-8208	Age-resistant and yellowing-resistant
Sixth generation	BQ-8232, BQ-8278	Moisture resistance, peel resistance

Each generation of product upgrades is a precise response to the industry’s pain points—insufficient adhesive strength, delamination after thermal shock, blackening due to vulcanization, yellowing at high temperatures, moisture ingress, and more.

The resolution of these issues has enabled Betely encapsulant adhesives to steadily gain a firm foothold in the market.

II. Mini-LED Has Arrived—So Have the Challenges

Mini-LED is one of the hottest technological trends in the display industry in recent years.

It fabricates LED chips to an extremely small size—around 100 microns—and arranges them densely to form a backlight module. Compared with conventional LCDs, Mini-LED offers higher brightness, superior contrast, and a longer lifespan.

According to data from the China Business Intelligence Network, China’s Mini-LED backlight product shipments reached 12.8 million units in 2024, with Mini-LED‑backlit TVs accounting for 8.2 million units—a doubling compared with the previous year.

However, Mini-LED places higher demands on the encapsulant:

● High dispensing accuracy: The adhesive dots are extremely small, requiring precise control of both shape and height.

● Stringent consistency: Tens of thousands of adhesive dots must maintain a high degree of uniformity.

● High reliability: Applications such as in-vehicle systems and television demand long service life and high stability.

Traditional high-refractive-index encapsulants may not be suitable for Mini-LED applications. Betely requires a new technological solution.

III. Betely Mini-LED Encapsulation Adhesive Solution

For Mini-LED applications, Betely has launched a medium-refractive-index silicone resin encapsulant system (BQ-4916A/B, BQ-4940A/B), achieving several technological breakthroughs:

1. Optimize the light-emission angle

By optimizing the adhesive’s fundamental parameters, the light emission angle is improved, enhancing display performance.

2. Precision Grinding Process

Employing a precision grinding process, the precipitated silica achieves a more uniform particle size and dispersion within the system, ensuring consistent light output—crucial for maintaining display uniformity in Mini-LED applications.

3. Precise Thixotropy Control

In the Mini-LED dispensing process, thixotropy directly affects the shape of the dispensed droplets. Poor control of thixotropy can cause the droplets to collapse or develop sharp tips.

Betely Mini-LED encapsulant has been formulated to deliver excellent thixotropic properties, ensuring that the dispensed bead is full and uniform.

4. Control of Dimensional Variation Rate

By precisely controlling the dimensional change rate before and after curing, batch-to-batch consistency in adhesive bead height and shape is ensured.

IV. Beyond Mini-LED: Continuous Breakthroughs in Core Performance Metrics

During the technological upgrade of encapsulant materials, Betely has continuously optimized around the following key performance indicators:

Performance Metrics	Technical Challenges	Betely solution
Sulfur-resistant	The silver layer in LED brackets is susceptible to sulfur-induced corrosion, resulting in blackening.	Develop a highly sulfur-resistant formulation (BQ-4242)
Cold and heat shock	The thermal expansion coefficients of the chip and the encapsulant adhesive differ significantly, making delamination easy.	BQ-8232 has passed the -45 to 125°C cycling test.
Moisture resistance	Moisture ingress causes LED defects.	After a 1-hour double-85 test, no delamination was observed following reflow soldering.
Age-resistant	Yellowing and cracking after prolonged use	BQ-8101 achieves 500 hours of high-temperature baking at 250°C without cracking.

These breakthroughs in technical performance have laid the groundwork for Betely encapsulant to penetrate higher‑end application markets, including automotive, outdoor, and industrial sectors.

V. Preview

From general lighting to Mini-LED, Betel has achieved a technological leap from “high refractive index” to “medium refractive index.”

But this is not the end. In the next installment, we will explore Betely broader materials portfolio in the LED field—epoxy encapsulants, die‑attach adhesives, underfill compounds, surface‑coating products, and future technology trends.

Stay tuned!

Breaking free from the constraints of single-product offerings, Betely is building a comprehensive LED materials portfolio spanning all categories.

Understanding LED Encapsulation Adhesive in One Article

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