Breaking free from the constraints of single-product offerings, Betely is building a comprehensive LED materials portfolio spanning all categories.
2026-06-18 10:25
In the previous two installments, we introduced what LED encapsulant is and Betely technological breakthroughs in the Mini-LED field.
In this issue, we broaden our perspective—Bettley’s contributions to the LED industry extend far beyond encapsulant adhesives.
Organosilicon encapsulants offer advantages in high-temperature resistance and aging resistance, but epoxy resins excel in mechanical strength and gas tightness.
Epoxy encapsulant is suitable for outdoor and industrial lighting applications that demand higher mechanical strength and weather resistance.
Betely epoxy encapsulant has been validated through testing by multiple customers and has achieved stable mass production.
The test results are as follows:
● Thermal shock: -45 to 125°C, one cycle every 30 minutes, passed the test.
● Reflow soldering: 150–250°C, three reflow cycles, passed testing.
This means that Betely epoxy encapsulant has already established the foundation for entering the mid- to high-end lighting market.
Prior to encapsulation, the leadframe surface is pre-treated with a primer to enhance adhesion and sulfur resistance.
Betely has developed a new generation of high-performance primers, with the following key features:
● Develop two solvent systems—fast-curing and slow-curing—based on customer requirements.
● The base film exhibits excellent gas tightness, significantly enhancing resistance to sulfidation.
● Excellent aging resistance, meeting the requirements of automotive-grade and other high-end applications.
Coating‑type products apply a dense protective film to the surface of the LED chip after encapsulation is complete.
The function of this film is:
● Significantly enhances sulfur resistance
● Enhanced anti-pollution performance
● Suitable for high-reliability applications such as outdoor and automotive environments.
Coating products, leveraging a dense crosslinked structure and a wealth of active functional groups, form a robust protective layer on the surface of LED beads—representing Betely latest innovation in the field of LED materials.
Micro-LED packaging materials
Micro-LED represents a more advanced technological frontier than Mini-LED, with chip sizes smaller than 50 microns and correspondingly higher demands on packaging materials.
Betely is currently in the technology‑readiness phase, continuously monitoring trends in Micro‑LED development to ensure materials are ready for the next‑generation display technology.
Automotive-grade LED packaging
With the growing popularity of new-energy vehicles, applications such as vehicle headlights, ambient lighting, and through‑type tail lamps are placing increasingly stringent demands on the reliability of LED packaging materials.
Betely is expanding its encapsulant product portfolio toward automotive-grade specifications to meet the high-temperature, high-humidity, and long‑life requirements of in‑vehicle applications.
From encapsulant adhesives to epoxy resins, from die‑attach adhesives to undercoats, and from surface‑coating products to Micro‑LED reserves—
In the LED sector, Betely materials portfolio is evolving from “single‑product offerings” to “system‑level solutions.”
This road is far from reaching its end.
Micro-LEDs, automotive-grade packaging, additional new materials, and an expanding array of cutting-edge technologies and products are still under development and testing.
The next decade is worth looking forward to.
Product inquiries (WeChat)
Email: betely@betely.com
Headquarters Address: No. 12, Dongzhou Road, Changshu Economic Development Zone, Jiangsu Province
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