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Conductive Polymer Paste
- Laser-engraved silver paste
- Fine-line printing silver paste
- Flexible Circuit Silver Paste (Halogen-Free/Halogenated Silver Paste)
- Flexible conductive silver-copper paste
- Conductive carbon paste for thin-film circuits
- Low-temperature curing silver paste
- Biosensing Conductive Silver Paste
- Biosensing functional carbon paste
- Silver–silver chloride reference slurry
- Heterojunction main and auxiliary grid silver (copper) paste
- Conductive silver paste for epoxy systems
- (High/Low Temperature) High-Conductivity Silver Paste / Special-Electrode Silver Paste
- Silver paste impregnation for tantalum/aluminum capacitors
- Tantalum/Aluminum Capacitor Impregnated with Carbon Paste
- Laminated aluminum dot-edge silver paste
- Perovskite tandem solar cell silver (copper) paste
- Air-atmosphere-cured copper paste
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High-temperature Sintering Slurry
- High-Temperature Sintering Silver Paste for Ceramic/Glass Substrates
- High-Resistance Silver Paste for Glass Substrates
- Silver paste for RF electrodes and GPS antennas
- Silver paste for power protection devices and silver paste for firing‑in holes in fired ceramics
- Silver-line protective glass paste
- Low-temperature sintered silver paste for aluminum substrates
- 5G filters and MONO silver paste dip coating
- 5G filter silver paste coating
- LTCC and ferrite internal paste
- LTCC and ferrite end paste
- LTCC via-filling silver paste
- Automotive defogging line silver paste
- Photovoltaic seed-layer silver paste
- Copper paste sintered in a nitrogen atmosphere
- Air-atmosphere sintered copper paste
- Conductive Silver Powder
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Conductive Polymer Paste
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Silicone Rubber
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Liquid Silicone Rubber
- Flame-retardant liquid silicone rubber
- Self-adhesive liquid silicone rubber
- Medical-grade liquid silicone rubber
- Thermally conductive liquid silicone rubber
- Organosilicon leather adhesive
- Two‑component liquid silicone rubber
- Ceramicizing Liquid Silicone Rubber
- Self-lubricating liquid silicone rubber
- High-transparency liquid silicone rubber
- General-purpose liquid silicone rubber
- Label adhesive
- Solid Silicone Rubber
- LED Encapsulant Adhesive
- Silicone Gel
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Liquid Silicone Rubber
- Silicone Oil
- Silicone Resin
- Silicone Additive
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Silicone Rubber
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From silver‑plated copper to copper powder: Betely portfolio of conductive materials
2026-03-05 14:02
Issue 3: Copper Powder—More Than Just “Grinding Copper into Powder”
After discussing silver‑copper powder in the first two episodes, a listener asked: “Since you’re making silver‑copper powder and the powder is synthesized in‑house, do you also produce the copper powder yourself?”
Yes, and I’ve been doing it for many years.
Copper powder—easy to talk about, but far from simple to produce. The market offers several types: electrolytic, atomized, reduced, and chemically synthesized. At first glance, they all look like copper powder, but their performance in ink formulations can differ dramatically.
I. The “background” of copper powder determines its “character.”
How is copper powder produced? Depending on the preparation process, the powder’s morphology, particle size, and surface characteristics vary—these differences ultimately manifest in the slurry’s performance.
| Craftsmanship | Typical morphology | Core Advantages | Core drawbacks | Mainstream applications |
| Electrolysis | Branch-like | High purity and excellent electrical conductivity | High energy consumption | Powder metallurgy, conductive materials |
| Gas atomization | High spherical | Good liquidity | High cost | 3D printing, MIM, conductive materials |
| Water atomization | Spheroidal | High yield, low cost | Sphericity is average. | General metallurgy, welding electrodes |
| Reduction method | Spongy | Low cost, excellent sintering | Poor liquidity | Catalysts, metallurgical components |
| Chemical method | Ultrafine/Nano | Small particle size, customizable | Costs are controllable. | Conductive pastes, flexible electronics |
| Mechanical method | Flaky/Irregular | Simple process | Many impurities | Low-end coatings, fillers |
When producing conductive pastes, the powder is the first critical step. The particle size should be small, the morphology uniform, and the surface active. —Of these three, the chemical method is the most suitable.
II. Betely Cu‑H Series: Synthesized via chemical methods, specifically designed for conductive pastes.
We have been developing conductive materials for twenty years, progressing from silver powder to silver‑coated copper and then to copper powder—always following the same path: synthesizing the powders in‑house to control quality at the source.
Cu-H series copper powders are synthesized via a chemical method and possess several distinctive features:
● Uniform particle size: Adjustable from sub-micron to micron scale, with a narrow particle size distribution and an easy-to-formulate slurry.
● High sphericity: Good fluidity and enhanced printability.
● Surface Treatment: Perform antioxidant modification prior to shipment to provide a process window for downstream applications.
● High purity: Impurity control is stringent and does not affect electrical conductivity.
III. Product Portfolio: Four Models Covering Mainstream Needs
| Model number | D50 (μm) | Tap Density (g/cm³) | Specific surface area (m²/g) |
| Cu-H-07 | 0.6-0.9 | ≥3.0 | 1.1-1.6 |
| Cu-H-20 | 1.8-2.4 | ≥3.5 | 0.5-0.7 |
| Cu-H-30 | 2.7-3.6 | ≥4.0 | 0.28-0.42 |
| Cu-H-40 | 3.6-4.5 | ≥4.0 | 0.16-0.36 |




(TEM images of Betely Cu-H series copper powders, from left to right: Cu-H-07, Cu-H-20, Cu-H-30, Cu-H-40)
As shown in the figure, the particle uniformity is immediately apparent. This is no accident; it is the result of chemical synthesis combined with rigorous size fractionation.
IV. Application Directions
Where can copper powder be used? At present, we see several clear applications:
● Photovoltaic conductive paste: Compatible with silver‑plated copper or pure copper systems.
● PCB via metallization: Alternative scenarios for silver paste
● Conductive ink: Flexible Printed Electronics
● Conductive adhesive: Electronic packaging
Each application has slightly different requirements for the powder, which is why we offer four models—not to pad the lineup, but to give our customers a range of options.
Next episode preview: The microscopic world of copper powder determines its macroscopic applications.
In this episode, we explored the origins of copper powder and its product family. In the next installment, we’ll zoom in to reveal what the Betely Cu‑H series looks like under an electron microscope—
How narrow is the particle size distribution?
How round is the sphericity, exactly?
How can surface treatment be performed to both prevent oxidation and maintain electrical conductivity?
Stay tuned for Part Two: “The Microscopic World of Copper Powder Determines Its Macroscopic Applications.”
Product inquiries (WeChat)
Email: betely@betely.com
Headquarters Address: No. 12, Dongzhou Road, Changshu Economic Development Zone, Jiangsu Province
Service Account
Official Account
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