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Raw materials for LED encapsulation resin

LED encapsulation materials are critical for ensuring high light extraction efficiency and long-term reliability in optoelectronic devices. Betely offers a comprehensive range of raw materials for LED encapsulation—spanning high to low refractive indices—to meet the diverse requirements for refractive index, light transmission, flexibility, and low stress across various applications, such as LED packages, Mini-LED displays, and COB light strips.

LED Encapsulation Adhesive Raw Material

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$High-refractive-index encapsulation adhesive$

High-refractive-index encapsulation adhesive

Encapsulation resin for LED beads

Refractive index ≥ 1.53, high light transmittance, high reliability, dispensing process

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$Medium-refractive-index encapsulation adhesive$

Medium-refractive-index encapsulation adhesive

Mini-LED encapsulation adhesive

Refractive index of 1.45–1.50; suitable for dispensing and molding, with excellent molding results and reliable application performance.

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$Low-refractive-index encapsulation adhesive$

Low-refractive-index encapsulation adhesive

Encapsulation adhesive for COB LED strips

Refractive index of 1.41, good flexibility, excellent molding performance, and outstanding adhesion.

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